Electroless Electroplating Unit is part of the Surface Treatments Laboratory infrastructure at ITU Surface Lab. This page summarizes where the device sits in the laboratory workflow, what kind of measurements or process steps it supports, and why it matters in applied surface engineering studies.
In practice, the device is used to compare coating behavior, process stability, microstructural response, or surface-related performance outputs under controlled research conditions. The goal is not only to list the equipment, but to clarify the role it plays in experiment design and interpretation.
The summary, metadata cards, and detailed content below connect the device to real laboratory questions such as deposition strategy, corrosion response, tribological performance, characterization depth, or data reliability across projects and publications.
Equipment Electroless Electropating Unit Brand Walter Lemmen Organic, chemical or galvanic protective coatings are used for oxidation and corrosion protection of PCB surface finishes. A high quality surface finish on PCBs is guaranteed thro
| Equipment | Electroless Electropating Unit |
|---|---|
| Brand | Walter Lemmen |
Organic, chemical or galvanic protective coatings are used for oxidation and corrosion protection of PCB surface finishes. A high quality surface finish on PCBs is guaranteed through the use of special equipment in combination with chemical processes. The final surface treatment of different PCB types can be integrated as an additional process, eg. in the COMPACTA device. The system configuration depends on different chemical treatments for the surface protection of the respective processes.
Systems for lead-free surface
– Electroless Nickel / Gold
– Immersion Tin – Immersion Silver
– Organic surface protection (OSP)
Equipment for special applications
– Galvanic Nickel / Gold
– Galvanic Silver
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